LATEST NEWS
New: Putty Gap Fillers – Basic, Advance, and Pro
Putty is an electrically non-conductive alternative to traditional thermal pads, specifically designed for upgrading graphics cards and replacing thermal pads between the PCB and the cooler. TG Putty is available in three variants, each distinguished by its thermal conductivity.
Important Information on Delidding Intel "Arrow Lake" CPUs
In this blog post, we aim to highlight the increased risk involved in delidding Intel Core Ultra 200 processors. We discuss how to delid these CPUs safely and what precautions to take. A video on this topic is also available here.
LATEST PRODUCTS
Delid-Die-Mate
The Intel 1851 Delid-Die-Mate V1 is a tool designed for removing the heat spreader (delidding) from Intel socket LGA1851 CPUs. Removing the heat spreader allows the installation of direct-die coolers, which dissipate heat efficiently directly from the CPU chip.
Intel 1851 Mycro Direct-Die Pro
The Intel 1851 Mycro Direct-Die Pro RGB V1 is a water cooler optimized for the Intel LGA1851 platform, featuring a nickel-plated copper base plate and RGB lighting. The cold plate has micro cooling fins with low flow resistance. The cooler is placed directly on the chip of the delidded Intel CPU, ensuring the processor's heat takes the shortest possible path to the water loop.
CPU Contact Frame
The Thermal Grizzly Intel 1851 CPU Contact Frame V1 is a mounting aid for Intel motherboards with the LGA1851 socket. The contact frame replaces the standard ILM of the motherboard, optimizing the pressure applied to the CPU in the socket. This improves heat transfer from the CPU heat spreader to the CPU cooler.