LATEST NEWS

New: Putty Gap Fillers – Basic, Advance, and Pro

Putty is an electrically non-conductive alternative to traditional thermal pads, specifically designed for upgrading graphics cards and replacing thermal pads between the PCB and the cooler. TG Putty is available in three variants, each distinguished by its thermal conductivity.

Important Information on Delidding Intel "Arrow Lake" CPUs

In this blog post, we aim to highlight the increased risk involved in delidding Intel Core Ultra 200 processors. We discuss how to delid these CPUs safely and what precautions to take. A video on this topic is also available here.

LATEST NEWS

New: Duronaut High-Performance Thermal Paste with Exceptional Long-Term Stability

Duronaut is the latest thermal paste from Thermal Grizzly, offering exceptional long-term stability and high thermal conductivity. As a high-end thermal paste, Duronaut is ideal for gamers, overclockers, and demanding cooling systems in the industrial sector.

New: Putty Gap Fillers – Basic, Advance, and Pro

Putty is an electrically non-conductive alternative to traditional thermal pads, specifically designed for upgrading graphics cards and replacing thermal pads between the PCB and the cooler. TG Putty is available in three variants, each distinguished by its thermal conductivity.

LATEST PRODUCTS

Intel 1851 Delid-Die-Mate Heater V1

The Intel 1851 Delid-Die-Mate Heater V1 is a tool designed to assist in removing the heat spreader from Intel Core Ultra 200 CPUs using the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of the CPU and the delidder to the required 165°C for delidding.

Intel 1851 Delid-Die-Mate V1

The Intel 1851 Delid-Die-Mate V1 is a tool designed for removing the heat spreader (delidding) from Intel socket LGA1851 CPUs. Removing the heat spreader allows the installation of direct-die coolers, which dissipate heat efficiently directly from the CPU chip.

TG Putty

Thermal Grizzly Putty is an electrically non-conductive alternative to traditional thermal pads, specifically designed for GPU modifications and the replacement of thermal pads between the PCB and the cooler.