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7/19/24

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Important Note: Extension of compatibility for AMD products for the Ryzen 9000 launch

The new AMD Ryzen 9000 processors for the AM5 socket will be presented on July 31 and will be available in stores from the first week of August. The X3D models of the new CPUs based on the Zen 5 architecture will be subjected to a compatibility test at a later date. For the time being, we can only provide information on the “regular” Ryzen 9000 CPUs at this point.

The following products are compatible with AMD's Ryzen 9000:

WATER COOLERS

  • AM5 Mycro Direct-Die
  • AM5 Mycro Direct-Die RGB
  • AMD Mycro Direct-Die Pro RGB V1

HEATSPREADER

  • AM5 High Performance Heatspreader

MOUNTING FRAMES & KITS

  • Ryzen 7000 Direct Die Frame V2
  • AM5 Contact & Sealing Frame
  • AM5 Adapter & Offset Mounting Kit
  • AM5 Short Backplate
  • AM5 M4 Backplate

TOOLS

  • Ryzen 7000 Delid-Die-Mate
  • Ryzen 7000 Lapping Tool

ACCESSORIES FOR THERMAL PASTE

  • AMD Ryzen 7000 CPU Guard

The following products are NOT compatible with Ryzen 9000:

MOUNTING FRAMES & KITS

  • AMD Ryzen 7000 Direct Die Frame (without V2)

As soon as we have received the relevant information on Ryzen 9000X3D and have been able to check which of our products will be compatible, we will inform you immediately. If you have any questions about our products, you can contact our customer support team at any time.

AMD Mycro Direct Die Pro RGB: New Design and improved Performance

With an optimized cooling channel slot width and a U-shaped jet system cooling surface, the AMD Mycro Direct Die Pro RGB V1 offers outstanding performance compared to other water coolers. In addition to a revised surface structure, the AMD Mycro Direct Die Pro RGB V1 has a slightly adapted underside, in which the lower support points have been slightly reduced in size.

The main difference between Ryzen 9000 and Ryzen 7000 lies in the chiplets, which have become slightly smaller, and the SMD capacitors, which are located below and next to the CPU chiplets in the top view. AMD has arranged the SMDs under the CPU chiplets so that they are now slightly closer together. In response to this, we have adjusted the contact points marked in green in the following graphic and also made them slightly closer together. In our initial tests with Ryzen 9000, the previous geometry was also compatible without any changes. As mentioned above, this applies to the AMD High Performance Heatspreader and the previously released Mycro Direct-Die coolers. Nevertheless, we have decided to make the contact points slightly smaller in order to avoid any compatibility problems in the future (Ryzen 9000X3D).
(Source original image: Techpowerup)
(Rendering of the underside, changes highlighted in green)

The design of the AMD Mycro Direct-Die Pro RGB V1 includes an anodized aluminium cover with RGB LED lighting underneath. These illuminate the tempered acrylic glass and can be controlled via the 3-pin ARGB header (+5V/DATA/GND) via the mainboard. When the AMD Mycro Direct Die Pro RGB V1 is available, we will inform you accordingly and publish additional performance data.

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